Design for Automation and Circularity Engineer

Design for Automation and Circularity Engineer Location Spring, TX :

Unique mastery and recognized authority on relevant subject matter knowledge including technologies, theories and techniques. Contributes to the development of innovative principles and ideas. Successfully operates in the most complex disciplines, in which the company must operate to be successful. Provides highly innovative solutions. Leads large, cross-division functional teams or projects that affect the organization?s long-term goals and objectives. May participate in cross-division, multi-function teams. Provides mentoring and guidance to lower level employees. Routinely exercises independent judgment in developing methods, techniques and criteria for achieving objectives. Develops strategy and sets functional policy and direction. Acts as a functional manager within area of expertise but does not manage other employees as a primary job function. (TCP review board required in TCP families)

Responsibilities:

• Develops organization-wide architectures and methodologies for mechanical and thermal design and development across multiple platforms and organizations within the Global Business Unit.
• Identifies and evaluates new technologies, innovations, and outsourced development partner relationships for alignment with technology roadmap and business value; creates plans for integration and update into architecture.
• Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; integrates suggestions, updates, and innovations into overall architecture.
• Leverages recognized domain expertise, business acumen, and experience to influence decisions of executive business leadership, outsourced development partners, and industry standards groups.
• Provides guidance and mentoring to less- experienced staff members to set an example of mechanical and thermal design innovation and excellence.

Education and Experience Required:

• Bachelor's or Master's degree in Mechanical Engineering.
• Typically 10+ years experience.

Knowledge and Skills:

• Using ProEngineer or other 3D CAD software as a mechanical design tool.
• Excellent analytical and problem solving skills.
• Experience in mechanical and thermal architecture of electronics packaging design.
• Designing sheet metal and plastic parts and associated production tooling and processes.
• Using CFD and thermal mockups to validate thermal solution.
• History of innovation with multiple patents in the field of electronics packaging.
• Excellent written and verbal communication skills; mastery in English and local language.
• Ability to effectively communicate product architectures, design proposals and negotiate options at business unit and executive levels.